M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems the locations of the reference

the locations of the reference points that separate the various segments of the edge profile are determined

The VLSI grade purity level is typically required by semiconductor devices with geometries of 0

SEMI E88-0307 (Reapproved 0318)

support equipment

SEMI C61-0707 (Withdrawn 0114)

M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles StdTpc-Automated Material Handling Systems the locations of the reference1 Purpose 1. 1 SEMI M1 specifies the contour of the shaped edge of silicon wafers by using templates that allow a wide variation in wafer edge profiles manufactured by silicon suppliers to still meet the specification. 1. 2 In many advanced wafer applications, a much tighter specification of the edge profile is required to control variations in subsequent circuit processing. These specifications frequently include values for certain characteristics