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SEMI ソフトウエアスタンダードSECS/GEMセミナー StdTpc-Package Test Methods SEMI E142-0224E (editorial revision)

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SEMI E142-0224E (editorial revision)

SEMI PV76-0622 (technical revision)

1  Through glass vias is an emerging technology in the semiconductor industry

such as nano indentation or nano-dynamic mechanical analysis (DMA)

本规范用语规定聚乙烯包装材料的质量及分析方法。因低质量的PE包装袋会在多晶硅的运输过程中污染多晶硅，因此对PE袋的质量要求进行规范。为了产业链控制额外的成本，加强生产商和使用者的沟通，制定本规范。

SEMI ソフトウエアスタンダードSECS/GEMセミナー StdTpc-Package Test Methods SEMI E142-0224E (editorial revision)2411450 68741112 3545469 616379359

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