G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced a fitting body temperature range

a fitting body temperature range of 23°C to 125°C (73°F to 257°F) should be maintained

For wafer boxes used with 100 mm to 200 mm diameter wafers

or remove instances of objects (and manage collections of those objects) that support the CIM Framework specified interfaces

capacitance

n/n+[n++]) by microwave photoconductive decay method using short wavelength excitation light source (the short wavelength excitation µ-PCD method)

G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced a fitting body temperature rangeThis specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins. Referenced SEMI Standards None.