M06000 - SEMI M60 - シリコンウェーハ評価のためのSiO2の経時絶縁破壊特性の試験方法 Revision:SEMI M60-0306E2 - Superseded 1-95 (first published)

1-95 (first published)

SEMI D3 — Quality Area of FPD Substrates

This Guide does not require large volumes of resin in order to determine resin quality

SEMI D39-0704 (Reapproved 0117)

chemical mechanical planarization (CMP)

M06000 - SEMI M60 - シリコンウェーハ評価のためのSiO2の経時絶縁破壊特性の試験方法 Revision:SEMI M60-0306E2 - Superseded 1-95 (first published)global Silicon Wafer Committee20051129global Audits and Reviews Subcommittee20062www. semi. org20063CD ROM2005120053 E2006510. 2. 7 GOIGate Oxide Integrity3M51TZDB(B)(C)TZDB Referenced SEMI Standards SEMI C3. 6 Standard for Phosphine (PH3) in Cylinders, 99. 98% Quality SEMI C3. 54 Gas Purity Guideline for Silane (SiH4) SEMI C21 Specifications and Guideline for Ammonium Hydroxide SEMI C27 Specifications and Guidelines for Hydrochloric Acid SEMI C28