E09600 - SEMI E96 - Guide for CIM Framework Technical Architecture Revision:SEMI E96-1101 - Superseded SEMI F48-0200 (first published)

SEMI F48-0200 (first published)

The Test Method is based on simultaneously measuring the wafer top and bottom surface position with an aligned pair of laser triangulation sensors when the wafer passes through the gap formed between the laser triangulation sensor pair

Method B is nondestructive and suitable for inspection of all points on the wafer periphery except flats or notches

The method described is destructive in nature but is more widely applicable than the alternative infrared method

本方法可便于在世界各地实验室之间统一测试方案和测试结果，用于监测或测量硅粉中B

E09600 - SEMI E96 - Guide for CIM Framework Technical Architecture Revision:SEMI E96-1101 - Superseded SEMI F48-0200 (first published)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Guide describes technical architecture choices that enable application components to cooperate in a computer integrated manufacturing (CIM) environment and reduce the effort required to integrate those components into