MF011000 - SEMI MF110 - Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique Revision:SEMI MF110-1107 (Reapproved 0718) - Superseded Originally published December 1996

Originally published December 1996

which is used to rank the pitting corrosion resistance of wetted surfaces of tubing or test coupons of representative finished surfaces intended for use in corrosive gas systems

This Standard describes a specific device structure and behavior of a generic equipment networked sensor

SEMI D78-0224 (technical revision)

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MF011000 - SEMI MF110 - Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique Revision:SEMI MF110-1107 (Reapproved 0718) - Superseded Originally published December 1996This Test Method covers a procedure suitable for interlaboratory comparisons of layer thickness. This Test Method is applicable for layers of any resistivity so long as the layer differs from the silicon substrate under it either in conductivity type or by at least one order of magnitude in resistivity. The method described is destructive in nature but is more widely applicable than the alternative infrared method, SEMI MF95. For layers with