T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications StdTpc-Electronic Data Interchange orgで入手可能になり，2004年3月発行に至る。

orgで入手可能になり，2004年3月発行に至る。

本テスト方法は，大気中の酸素の浸入を検出することによって，超高純度（UHP）ガス分配システムの完全性を監視する手順について規定する。本テスト方法は，対象となっているUHPガスを使用したプロセス装置の中断を必要とせずに，非浸入式のO2測定を使用することによって，「活動中の」UHPガス分配システムを連続的に評価するために使用される。

one of the problems is to identify and eliminate the sources of mechanical defects such as thermo-elastic stress and cracks leading to the loss of wafer integrity and ultimate breakage of as-grown and processed Si cells

this Practice defines a wafer coordinate system to facilitate the precise locating and reporting of points on the wafer surface

This Specification defines a common set of feature requirements on and about tool ports of process tools used in manufacturing of flat panel displays

T02400 - SEMI T24 - Specification for ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications StdTpc-Electronic Data Interchange orgで入手可能になり，2004年3月発行に至る。This Specification is intended to provide a marking symbology that can be used to mark glass carrier characteristics for panel level packaging (PLP). This Specification defines the geometric shape, size and content of a rectangular two dimensional (2D) code symbol for back surface marking of the glass carrier for use in PLP applications. Although this Specification does not specify the marking techniques that may be employed when complying with its