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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 SEMI E119 — Mechanical Specification
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 SEMI E119 — Mechanical Specification
$193.00
Description
SEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers
SEMI D61-0723 (technical revision)
The Redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded)
organics contribution
and behavior identified in these Standards
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding StdPbc-1119 SEMI E119 — Mechanical SpecificationThis Standard defines the pull strength test method for wire bonding. Referenced SEMI Standards None.
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