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High Temperature Hot Melt Tape MC388 accurate alignment of components to

$500.00

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Description

accurate alignment of components to PCB pads

high-quality soldering across all assembly types

BGA Image Processor w/ Auto-BGA Analysis for Measuring Ball Size

The AP660 uses a parallel stencil-to-PCB lift system to ensure uniform separation across the entire print area

Uniform stencil separation: maintains even lift across the full print area

High Temperature Hot Melt Tape MC388 accurate alignment of components to

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  • Delivery to the USA:
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