US$ 81.00
High Temperature Hot Melt Tape MC388 accurate alignment of components to
$500.00
Description
accurate alignment of components to PCB pads
high-quality soldering across all assembly types
BGA Image Processor w/ Auto-BGA Analysis for Measuring Ball Size
The AP660 uses a parallel stencil-to-PCB lift system to ensure uniform separation across the entire print area
Uniform stencil separation: maintains even lift across the full print area
High Temperature Hot Melt Tape MC388 accurate alignment of components to
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
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