Home
»
»
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11 Type-itel Spare Parts Carton Size 50cm * 30cm
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11 Type-itel Spare Parts Carton Size 50cm * 30cm
$13845.31
Description
Carton Size 50cm * 30cm * 30cm / 19
HDMI interface can output video resolution up to 4Kx2K UHD
DSP active noise reduction can accurately identify and effectively suppress external noise
Qualcomm baseband
Waterproof level: not waterproof
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11 Type-itel Spare Parts Carton Size 50cm * 30cm1. Fast and stable, precise positioning 2. High temperature resistant material, not easy to deform, no bulge, no virtual welding. 3. Assist professionals to carry out BGA tin planting in a convenient and safe way. 4. For iPhone A11 5. The strength is more durable and not deformed 6. Dimensions: 85 x 85 x 15mm 7. Weight: 376 grams Specification: General Compatible with Apple: iPhone 11 Package Weight One Package Weight 0. 40kgs 0. 89lb One Package Size
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
