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Semiconductor devices. Mechanical and climatic test methods - Die shear strength Ingestion-build-205840 The intended use of pulse1 Scope This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term semiconductor die should be taken to include passive elements). This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to