10000 cm2 V. S EPD <2E4 cm 2 Standard thickness 500 20 mm Size ellipse shape, (area > 30mm diameter) Polish one side"> 10000 cm2 V. S EPD <2E4 cm 2 Standard thickness 500 20 mm Size ellipse shape, (area > 30mm diameter) Polish one side"> 10000 cm2 V. S EPD <2E4 cm 2 Standard thickness 500 20 mm Size ellipse shape, (area > 30mm diameter) Polish one side"> InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes La 45") 1 Resin50 Resin Bonded – peerflow.io

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InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes La 45") 1 Resin50 Resin Bonded

$126.50

Quantity
Description

45") 1 Resin50 Resin Bonded Ceramics for Sample Holding 2 LSS009 Aluminum Plate  2 LSS010 Wexford for samples bounding 1 set LSS012 One Fuse 1  LSS013 AC Power Cord 1 LSS014 Screw Driver 1 set LSS015 Two Motor belts per set for of Driving Motor 1 set LSS016 A bag of 150-Lube Cutting Lubricant

5"thickness (900 x 600 x 60 mm

Oxygen free copper gasket for high vacuum sealing of 61mmOTF-1200X-HP-30

ready for GSL-1100X-SPC12

Surface load: 13

InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes La 45") 1 Resin50 Resin BondedGrowth method LEC Orientation (411) 0. 5 Deg Orientation Flat N A Doping S doped Conductivity type N type Carrier Concentration <7E17 ~ 1E18 cm3 Mobility >10000 cm2 V. S EPD <2E4 cm 2 Standard thickness 500 20 mm Size ellipse shape, (area > 30mm diameter) Polish one side

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