Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile Ingestion-build-143074 BS EN 60107-8 discusses measurements

BS EN 60107-8 discusses measurements

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Size codes and associated body measurements

Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile Ingestion-build-143074 BS EN 60107-8 discusses measurements1 Scope This part of IEC 60068, which is a technical report, presents two approaches for establishing a possible temperature profile for a lead free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e. g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production