Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 The scope of BS ISO

The scope of BS ISO IEC 29794 does not cover:

used to measure volumes of distributed fuel gases of the second and/or third family

BS EN 61508-1:2010 General requirements

Drop in electrical resistance

and requirements on joints

Integrated circuits. Three dimensional integrated circuits - Alignment of stacked dies having fine pitch interconnect Ingestion-build-52208 The scope of BS ISOWhat is this standard about? This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die to die alignment is used in the die stacking.