G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 - Superseded such as their locations

such as their locations

the consumers) without the need to send the data multiple times to multiple destinations

This Standard is applicable to BLU for liquid crystal display (LCD) and the measurement includes only the optical area

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This edition was approved for publication by the global Audits and Reviews Subcommittee on May 21

G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 - Superseded such as their locationsNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers